A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging

ANFIS Approach for Tracking Control of MEMS Triaxial Gyroscope

In this paper, an Adaptive Neuro Fuzzy Inference System (ANFIS) based control is proposed for the tracking of a Micro-Electro Mechanical Systems (MEMS) gyroscope sensor. The ANFIS is used to train parameters of the controller for tracking a desired trajectory. Numerical simulations for a MEMS gyroscope are looked into to check the effectiveness of the ANFIS control scheme. It proves that the sy...

MEMS Post-Packaging by Localized Heating and Bonding

This work addresses important post-packaging issues for microsystems and recommends specific research directions by localized heating and bonding. Micropackaging has become a major subject for both scientific research and industrial applications in the emerging filed of microelectromechanical systems (MEMS). Establishing a versatile post-packaging process not only advances the field but also sp...

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

Design Rules for Wafer Level Packaging of MEMS, CMOS-MEMS Integration, and Smart Systems using Anodic Bonding and Lateral Feedthroughs

The advantages of wafer level packaging (WLP) are widely recognized across a range of applications MEMS, IC’s Smart systems, CMOS-MEMS integration, System on Chip (SoC), Package in Package (PiP), Package on Package (PoP ) etc. Key benefits include true chip-size package, reduced cost of interconnects (by creating at wafer-level rather than back-end chip-scale packaging), and minimising test and...

A Modular, Chip Scale, Direct Chip Attach MEMS Package: Architecture and Processing

This paper describes the development of a chip scale microelectromechanical system (MEMS) carrier compatible with modern surface mount assembly. Such a package could facilitate the commercial implementation of many MEMS devices currently feasible only as prototypes. In order to achieve the project goals, work focused on the reduction of MEMS package volume and on the incorporation of solder int...